Solder Paste Inspection (SPI) System Market Application & Region Specific Demand 2020

JAN 08 2021: The global Solder Paste Inspection (SPI) System market was valued at $XX million in 2018, and Radiant Research analysts predict the global market size will reach $XX million by the end of 2028, growing at a CAGR of XX% between 2018 and 2028.

This report provides detailed historical analysis of global market for Solder Paste Inspection (SPI) System from 2013-2018, and provides extensive market forecasts from 2019-2028 by region/country and subsectors. It covers the sales volume, price, revenue, gross margin, historical growth and future perspectives in the Solder Paste Inspection (SPI) System market.

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Leading players of Solder Paste Inspection (SPI) System including:

  • Koh Young (Korea)
  • CyberOptics Corporation
  • Test Research, Inc (TRI) (Taiwan)
  • MirTec Ltd (Korea)
  • PARMI Corp (Korea)
  • Viscom AG (Germany)
  • ViTrox (Malaysia)
  • Vi TECHNOLOGY (France)
  • Mek (Marantz Electronics) (Japan)
  • CKD Corporation (Japan)
  • Pemtron (Korea)
  • SAKI Corporation (Japan)
  • Machine Vision Products (MVP) (US)
  • Caltex Scientific (US)
  • ASC International (US)
  • Sinic-Tek Vision Technology (China)
  • Shenzhen JT Automation Equipment (China)
  • Jet Technology (Taiwan)

Market split by Type, can be divided into:

  • In-line SPI System
  • Off-line SPI System

Market split by Application, can be divided into:

  • Automotive Electronics
  • Consumer Electronics
  • Industrials
  • Others

Market split by Sales Channel, can be divided into:

  • Direct Channel
  • Distribution Channel

Market segment by Region/Country including:

  • North America (United States, Canada and Mexico)
  • Europe (Germany, UK, France, Italy, Russia and Spain etc.)
  • Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
  • South America Brazil, Argentina, Colombia and Chile etc.)
  • Middle East & Africa (South Africa, Egypt, Nigeria and Saudi Arabia etc.)

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Table of Contents

Chapter 1 Solder Paste Inspection (SPI) System Market Overview

1.1 Solder Paste Inspection (SPI) System Definition

1.2 Global Solder Paste Inspection (SPI) System Market Size Status and Outlook (2013-2028)

1.3 Global Solder Paste Inspection (SPI) System Market Size Comparison by Region (2013-2028)

1.4 Global Solder Paste Inspection (SPI) System Market Size Comparison by Type (2013-2028)

1.5 Global Solder Paste Inspection (SPI) System Market Size Comparison by Application (2013-2028)

1.6 Global Solder Paste Inspection (SPI) System Market Size Comparison by Sales Channel (2013-2028)

1.7 Solder Paste Inspection (SPI) System Market Dynamics

1.7.1 Market Drivers/Opportunities

1.7.2 Market Challenges/Risks

1.7.3 Market News (Mergers/Acquisitions/ Expansion)

Chapter 2 Solder Paste Inspection (SPI) System Market Segment Analysis by Player

2.1 Global Solder Paste Inspection (SPI) System Sales and Market Share by Player (2016-2018)

2.2 Global Solder Paste Inspection (SPI) System Revenue and Market Share by Player (2016-2018)

2.3 Global Solder Paste Inspection (SPI) System Average Price by Player (2016-2018)

2.4 Players Competition Situation & Trends

Continued…………………


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